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Build Edge AI Systems Using eFPGA Technology

“Sandwizz” Schematic-Configurable Breadboard Now on Kickstarter

Inside Electronics

Discussing the State of Advanced Intelligent Devices in the Cloud

What’s Next in Remote Monitoring for Digital Healthcare?

Featured

Isolated Gate-Driver ICs Handle Higher Voltage Levels in EVs

NXP upgraded its isolated gate drivers for the high-voltage era of the electric vehicle and is supplying them to ZF Friedrichshafen.

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Inside Electronics

Let’s Talk About Sensors and Analog Signal Conditioning

Special Report: Sensors and AFEs

Products and Solutions

Submit a New Product for an Edge Award

The Ins and Outs of Frequency Spread Spectrum

SEARCH FOR DATA SHEETS, PRICE, STOCK, AND PART STATUS OF ELECTRONIC COMPONENTS

Industry Insights

Engineering on Friday

The Videocassette Recorder: From Humble Beginnings to Obsolescence

11 Myths About Time-Sensitive Networking

Printed Circuit Boards

5 Practical Strategies to Address PCB Miniaturization Challenges

Protecting Against Quantum Attacks

Preventing Quantum Computers from Breaking Security

Test & Measurement

The Benefits and Limitations of Ranging on Your Battery Tester

Technology Advancements

Printed Circuit Boards

Look Out, FR-4: Recyclable PCBs May be Coming After You

What is PCMO ReRAM?

What is PCMO ReRAM?

Mastering the Challenges of Wireless EV Battery Management

Sensor Fusion: The Source of AI’s Foresight

Si, SiC, and GaN Unite in New Power-Supply Unit for AI

First Level 4 Self-Driving Tests Conducted on Class 8 Fuel-Cell Electric Truck

Heterogeneous 2

Heterogeneous 2.5/3D Chip Design Requires Integrated Tools

RedCap: Augmenting 5G to Support IoT Device Growth

Products and Solutions

Test & Measurement

Enhanced Oscilloscopes Give Engineers New Power-Analysis Options

Advanced 32-bit MCUs Enable a Secure, Connected, and Intelligent IoT

Advanced MCUs Foster a Secure, Connected, Intelligent IoT

In-Package Silicon Decoupling Cap Offers Large Value, Tiny Parasitics

Bringing High Power Density to Energy Harvesting

Analog

The Building Blocks of Smart Factories

Adopting AI-Based Circuit Optimization and Migration

How RF FDAs Enhance Test Systems with RF Sampling ADCs

Embedded

Arm Bets Big on AI with New Mobile CPU Cores

CC-Link IE TSN Helps Unlock the Smart Factory’s Potential

Sponsored Content

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series

Automation

Cloud-Based Visual Design Platform Creates Software Prototypes

Computer-Aided Design

Cloud-Based Visual Design Platform Creates Software Prototypes

Secure Industrial Network Connectivity Demo Uses Single-Pair Ethernet

Secure Industrial Network Connectivity Demo Uses SPE

RS-485 Transceiver IC Offers Enhanced Speed, Protection

ROS 2 Communication Stack: The Alternative Protocol

Power

3D-Printed Electromagnet Yields Powerful Solenoid

Ultra-Compact, 1.2/2.3-kV Gate Drivers Reveal Important Green Power Industry Trends

Test & Measurement

How to Accelerate Electric-Motor Drive Control Testing

Can I Power My Device with an Energy Harvester?

A New Generation of GaN Power ICs Mimic Silicon MOSFETs

EC Fans Make Cooling More Efficient and Sustainable

Communications

Sponsored Content

Learning Resources

Modernizing the Factory Floor with Ethernet, TSN, and Advanced Processing

IoT Laws Aim to Protect User Information and Mitigate Cybersecurity Threats

Buy vs. Build for Time-Critical Sensor Data Fusion

Everything Ethernet Everywhere

Test & Measurement

Tradeoffs in Analog Front-End Architectures for Power Applications

Compact Scope Targets Rackmount, Automated Test Apps

Achieving Safety Through Sensing

Inertial Modules Equipped to Handle Functional Safety Up to ASIL B

The Ever-Evolving CAD Software Industry

Test & Measurement

Cost-Effective Platform Performs OTA Vehicle-in-the-Loop Testing