Flow and Thermal Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure with a Localized Finned Heat Sink
Released on J-STAGE: November 20, 2011 |
Volume 19
Issue 3
Pages 81-93
Takashi FUKUE, Masaru ISHIZUKA, Kenta YAMAZAKI, Tomoyuki HATAKEYAMA, Shinji NAKAGAWA, Wataru NAKAYAMA