Editor-In-Chief
Prof. Tarlochan Sidhu
Professor
Faculty of Engineering and Applied Science
Ontario Tech University
2000 Simcoe Street North
Oshawa, Ontario
Canada L1H7K4
Associate Editors
S. Das, Indian Institute of Science, INDIA
Fei Gao, University of Technology of Belfort-Montbéliard, France
Y. Liao, University of Kentucky, USA
Gayadhar Panda, National Institute of Technology Meghalaya, INDIA
Salkuti Surender Reddy, Woosong University, Republic of Korea
Editorial Board
O.H. Abdalla, University of Helwan, EGYPT
B. Bhajla, Indian Institute of Technology, Roorkee, INDIA
M. El Hachemi Benbouzid,University of Western Brittany, FRANCE
W. Fan, Commonwealth Edison Company (ComEd), USA
Andrea Fioravanti, University of L'Aquila, ITALY
G. Harrison, The University of Edinburgh, UK
Y-L. Ke, Kun Shan University of Technology, TAIWAN
P. Lopes, INESC Porto, PORTUGAL
H. Nouri, University of the West of England, UK
R. Mota Palomino, National Polytechnic Institute, MEXICO
A. Pahwa, Kansas State University, USA
A.G. Phadke, Virginia Tech, USA
S. R. Salkuti, Woosong University, REPUBLIC OF KOREA
M. Sanaye-Pasand, University of Tehran, Iran
M. Shahidehpour, Illinois Institute of Technology, USA
C. Singh, Texas A&M University, USA
E. Tag-Eldin, Cairo University, EGYPT
D. Thukaram, Indian Institute of Science, INDIA
D. Tziouvaras, Schweitzer Engineering Labs, USA
K. Xu, Nanjing Institute of Technology, China
F. Wang, Shanghai University, Shanghai, CHINA
F. Wen, Zhejiang University, CHINA
I. Zamora, ETSI de Bilbao - University of the Basque Country, SPAIN