Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura

A Design Method of Compact Lumped-Element Matching Circuits for Diplexers Using SAW Filters

Released on J-STAGE: November 29, 2018 | Volume 11 Pages E17-015-1-E17-015-8

Shinpei Oshima, Tomonori Oshima, Takuto Numao, Koji Wada

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Released on J-STAGE: October 01, 2020 | Volume 13 Pages E19-017-1-E19-017-11

Dai Ishikawa, Bao Ngoc An, Matthias Mail, Helge Wurst, Benjamin Leyrer, Thomas Blank, Marc Weber, Suguru Ueda, Hideo Nakako, Yuki Kawana

UV Laser Releasable Temporary Bonding Materials for FO-WLP

Released on J-STAGE: January 30, 2019 | Volume 11 Pages E18-004-1-E18-004-7

Hikaru Mizuno, Hiroyuki Ishii, Hitoshi Kato, Takashi Mori, Hiroki Ishikawa, Yooichiroh Maruyama, Kenzo Ohkita, Koichi Hasegawa

Effect of Shear Speed on the Ball Shear Strength of Sn–3Ag–0.5Cu Solder Ball Joints

Released on J-STAGE: March 31, 2010 | Volume 1 Pages 9-14

Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa, Masao Kojima