Developing a leading practical application for 3D IC chip stacking technology
Released on J-STAGE: June 20, 2016 |
Volume 9
Issue 1
Pages 1-15
Masahiro AOYAGI, Fumito IMURA, Fumiki KATO, Katsuya KIKUCHI, Naoya WATANABE, Motohiro SUZUKI, Hiroshi NAKAGAWA, Yoshikuni OKADA, Tokihiko YOKOSHIMA, Yasuhiro YAMAJI, Shunsuke NEMOTO, Tung Thanh BUI, Samson MELAMED